Rogers IM Series™ laminates include the IM cladding solution of an ultra-smooth electrodeposited copper foil cladding option which has excellent adhesion to the substrate materials. These laminates consist of a PTFE resin system and are woven glass reinforced for excellent dimensional stability.
Low PIM of -166 dBc at .030”
Dk range of 2.17 to 2.94
Dissipation factor range of .0009 to .0021 at 10 GHz
Uniform mechanical properties
Very smooth copper foil with Rq = 0.5μm by non-contact interferometry method
Enables successful high performance antenna designs