The basis of the curamik® substrate is a ceramic isolator to which pure copper is applied. This thick copper layer produces ceramic substrates with high heat conductivity, high temperature resistance, high isolation voltage, and high heat spread.
Rogers curamik® technology is also used for high performance cooling devices. Inside is a channel structure made of thin copper foils, which is assembled into a hermetically tight block by the patented curamik bonding process. This produces a very high copper surface area, enabling efficient liquid cooling.
Direct bond copper (DBC) substrates consist of a ceramic isolator, Al2O3 (aluminium oxide) or AlN (aluminium nitride), onto which pure copper is bonded in a high temperature melting and diffusion process. The great heat conductivity of Al2O3 (24 W/mK), AlN (180/230 W/mK) and HPS (28 W/mK), as well as the high heat capacity and heat spreading provided by the thick copper layer (200 - 600 µm), make curamik ceramic substrates irreplaceable in power electronics.
The coefficient of thermal expansion of Al2O3 (7.1 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon (4 ppm/K). Therefore, DBC is a suitable substrate for robust packaging of bare dice since such assemblies are not likely to wear our during the product life.
Due to the use of pure copper, ampacity is unbeatable compared to alternative technologies. Similar to PCBs, layout may be customized.
Find out about our other patented technologies at work in our innovative designs: