• Low inductance
  • Controlled partial discharge
  • High current and voltage capabilities
  • Compact and flexible
  • Fully customized
  • Possibility of component integration ( e.g. Capacitors )
  • Wide range of products tailored to specific power density and inductance


ROLINX® CapLink Solutions

  • Unique soldering process mounts capacitors to ROLINX laminated busbars
  • Produces small, lightweight assemblies with extremely low inductance and high power density
  • Supports SiC technology

ROLINX® Compact

  • Most optimal connection solution for high power distribution in very limited space
  • Uses powder coating as outer insulation instead of insulation films, allowing for even greater compactness than a laminated busbar
  • Easy and quick to install
  • High power density capabilities and high temperature resistance


  • Most cost-efficient, simplified busbar solution
  • Designed to replace stacked busbars and simplify the supply chain


  • Flexible busbar with pure copper laminates
  • Offers flexibility for customized solutions
  • Space saving, easy and quick bending
  • Available in standard and customized length

ROLINX® Housing Solutions

  • Combines injection molding solutions with ROLINX busbar
  • Offers great flexibility for customized solutions
  • Features integration of connectors or structural functions

ROLINX® Hybrid

  • Combination of power and signal (logic) electronics on a single circuit
  • One-piece busbar solution reduces installation time and eliminates wiring errors
  • Simplifies the supply chain with a single-piece solution
  • Features integrated connectors and surface mount components

ROLINX® Performance

  • State-of-the-art laminated busbar technology for demanding, high power applications
  • Provides optimized inductance and controls partial discharge
  • Shaped to fit high voltage applications
  • Compact design

ROLINX® PowerCircuit Solution

  • Combines the advantages of PCB and laminated busbar
  • Meets the needs of low power applications with currents greater than 100 Amps
  • Fit for high volume assembly processes and interconnection techniques
  • Compact 3D design & wave soldering capability

ROLINX® Thermal

  • Enables existing power system design to be upgraded to a higher power level
  • Extended temperature 130 deg. C range and humidity rating
  • Allows for more power through the same copper section


Description Language File Type File Size
ROLINX Busbars General Overview English
ROLINX e-Mobility Solutions Brochure English


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