Rogers Corporation is a proud leader in thermal solutions that protect electronics and critical systems. The heat generated from electronic devices, systems and circuits require thermal management to maintain prime operating conditions and avoid premature component failure, performance throttling or user discomfort. Rogers Corporation provides solutions to fit every design need by means of heat-storage, heat-conduction and cooling materials. In addition to their sealing, gasketing and cushioning, Rogers Corporation silicones provide thermal insulation capabilities by reducing the transfer of heat between objects.

Heat Storage

HeatSORB™ phase change material consistently absorbs large amounts of heat in product designs with thermal cycling, avoiding temperature spikes and allowing devices to remain cooler for longer. HeatSORB accomplishes this by leveraging an immobilized compound that requires a large amount of enthalpy to transition from one physical state to another, providing long-lasting and reliable thermal management.

Heat Conduction

Rogers manufactures several heat conducting thermal management solutions, providing the necessary transfer of heat through solids to maintain optimal operating temperatures.

curamik® ceramic substrates provide high heat spreading, very high isolation voltage and enable chip-on-board production. These substrates use direct bond copper (DBC) technology to join conductors with alumina, aluminum nitride (AlN) or Silicon Nitride (Si3N4) to form high power circuitry.

ML Series™ laminates and prepregs are thermally conductive and spread heat away from components to reduce hot spots. These laminates are used in both single printed circuit boards (PCB) and multilayer PCBs.

TC Series™ laminates provide high power RF signal applications improved thermal management with high thermally conductive ceramic fillers and woven glass reinforcement.

COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is used to bond circuit boards to other materials and provide both thermally and electrically conductive properties.

The Secure® thermal transfer adhesive is a thermally conductive silicone polymer and adhesive material that provides electrical isolation in gaps while providing maximum heat removal.

Active Liquid Cooling

curamik® cooling solutions are hermetically sealed micro or macro channel liquid coolers that combine copper and ceramic DBC substrates with specific channels to provide well controlled thermal resistance, pressure drop and flow rate, ideal for high power applications.

Passive Liquid Cooling

curamik®  CoolEasy is a high precise machined copper cooler that provides a passive liquid cooling thermal management solution often used for laser diode applications.

Thermal Insulation

Whether it be Arlon®, BISCO®, or DSP silicones, Rogers' thermal insulation materials maintain reliability and functionality by protecting from extreme temperatures in multiple applications.



Related Products

92ML™ Materials

92ML™ Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems.

ARLON® Silicones

Rogers Corporation’s Arlon® Silicone Technologies are the industry leaders in silicone elastomers.

BISCO® Silicones

Rogers Corporation’s BISCO® product line is the world leader in silicone foams used for gasketing and sealing applications.


COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.

curamik® Cooling Solutions

Rogers Corporation offers a suite of advanced liquid cooling solutions powered by the state of the art curamik® bonding process.

HeatSORB™ Material

HeatSORB™ phase change material addresses thermal management issues by capturing heat and delaying temperature ramps, allowing devices to remain cool.

TC Series® Laminates

Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

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