Device failures caused by interference or noise from electromagnetic energy are increasing due to the growing number of products that contain sensitive electronic components. The smaller size and faster operating speeds of today’s electrical and electronic components make it more difficult to manage performance. Rogers offers an array of solutions for electrical insulation, conduction and EMI/RFI shielding to protect and insulate devices from electrical interference.
ARLON Coil Insulation products, field tested for over 50 years, provide excellent electrical insulation for large rotating machines and traction motors, even in the most challenging operating conditions.
COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Conductive adhesive films provide a convenient and reliable approach used to bond high power circuit boards to heavy metal backplanes or heat sinks.
ARLON Thermabond® electronic adhesives are a unique class of elastomeric thermal interface materials that provide thermal-mechanical stress decoupling and a reliable heat transfer path. With Thermabond, adjoining components move freely during operation -- preventing stress build-up created by CTE mismatch. Thermabond is available in a range of thermal conductivities, including an electrically conductive line for ground plane continuity, ESD grounding, EMI shielding and RF shielding.
BISCO® Silicone EC-2130 electrically conductive silicones reduce EMI and RFI at frequencies above 10 Ghz within compact handheld electronics, communication devices, electronic enclosures and laptop computers. These silicone EMI shields are formulated to have a low durometer, which creates the low compressive forces needed for challenging product designs.
Condux Plus™ Foams are the optimal solution for reliable electrical grounding and shielding in high quality mobile devices. The more compact the handheld device, the more complicated the design. With complicated designs come unexpected electrical grounding and shielding challenges. Condux Plus™ foam offers high, reliable electrical conductivity, excellent mechanical properties and great shielding capabilities to act as a trusted grounding pad within mobile devices.