TC600 laminates best-in-class thermal conductivity and mechanical robustness enable printed circuit board (PCB) size reduction. The increased thermal conductivity provides higher power handling, reduces hot-spots and improves device reliability.


  • Dielectric constant (Dk) of 6.15
  • High thermal conductivity of 1.0W/mK
  • Stable Dk across wide temperature range of -75ppm/°C from -40°C to 140°C
  • Low loss tangent of .002 at 10 GHz
  • Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C)


  • Enables size reduction of PCB relative to lower Dk substrates
  • Reduced heat generated through transmission line loss
  • Improved processing and reliability
  • CTE matches active components for low stress solder joints


Description Language File Type File Size
Data Sheet
TC600™ Laminates Data Sheet English
Fabrication Information
Fabrication Guidelines TC350-TC600 Laminates English


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