Designed for use as inner-layers in multi-layer board (MLB) designs, RO4835T complements RO4835™ laminates when thinner cores are needed. RO4835T laminates feature high performance material attributes that provide an optimum blend of price, performance and durability with the capability of being fabricated using standard FR-4 (epoxy/glass) processes.


  • Available in 2.5, 3 and 4 millimeter thickness
  • Dielectric constant (Dk) of 3.3
  • Excellent oxidation resistance, compared to typical thermoset microwave materials
  • Low loss, low CTE material
  • Flame retardant laminate, UL 94 V-0 rated


  • CAF resistant
  • Ease of PCB manufacturing and assembly in line with FR-4
  • Minimizes local variation of dielectric constant
  • Improved MLB design flexibility
  • Improved design flexibility, PTH reliability and automated assembly compatibility


Description Language File Type File Size
Data Sheet
RO4835T Laminate Data Sheet English
RO4835T™ 层压板数据资料表 中文
Fabrication Information
Fabrication Guidelines RO4835T Core-RO4450T Bonding Layers Multi-layer Board Procesing Guidelines English
Frequently Asked Questions
Improved Flatness of RO4000-FR4 Hybrid Multi-layer Boards English


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